The frontal thermal oxidation process and PE coating process are deeply optimized to achieve excellent PID resistance;
Process low silicon wafer thickness loss process and low thermal stress process, so that the product has excellent mechanical load performance requirements;
Fully automatic appearance, EL, electrical performance test equipment to ensure product quality stability;
The frontal thermal oxidation process and PE coating process are deeply optimized to achieve excellent PID resistance;
Process low silicon wafer thickness loss process and low thermal stress process, so that the product has excellent mechanical load performance requirements;
Fully automatic appearance, EL, electrical performance test equipment to ensure product quality stability;
The frontal thermal oxidation process and PE coating process are deeply optimized to achieve excellent PID resistance;
Process low silicon wafer thickness loss process and low thermal stress process, so that the product has excellent mechanical load performance requirements;
Fully automatic appearance, EL, electrical performance test equipment to ensure product quality stability;
